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1

Some thoughts on bondability and strength of gold wire bonding

Zulkifli, Muhammad Nubli, Abdullah, Shahrum, Othman, Norinsan Kamil, Jalar, Azman

Journal:

Year:

2012

Language:

english

File:

PDF, 906 KB

english, 2012

2

Hardness Variation of Ball Bond Wire Bonding

Zulkifli, Muhammd Nubli, Jalar, Azman, Abdullah, Shahrum, Shamsudin, Roslinda, Zulkifli, Rozli

Journal:

Advanced Materials Research

Year:

2011

Language:

english

File:

PDF, 268 KB

english, 2011

3

Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

Ismail, Norliza, Jalar, Azman, Abu Bakar, Maria, Safee, Nur Shafiqa, Wan Yusoff, Wan Yusmawati, Ismail, Ariffin

Journal:

Soldering & Surface Mount Technology

Year:

2020

File:

PDF, 4.01 MB

2020

4

The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging

Ismail, Roslina, Omar, Ghazali, Jalar, Azman, Majlis, Burhanuddin Yeop

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 1.57 MB

english, 2015

5

The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition

Mohd Khairuddin Md Arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 1.01 MB

english, 2006

6

Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu

Ismail, Norliza, Jalar, Azman, Abu Bakar, Maria, Ismail, Roslina, Saedi Ibrahim, Najib

Journal:

Soldering & Surface Mount Technology

Year:

2020

File:

PDF, 1.86 MB

2020

7

Deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) solder wire under varied tensile strain rates

Abdullah, Izhan, Zulkifli, Muhammad Nubli, Jalar, Azman, Ismail, Roslina

Journal:

Soldering & Surface Mount Technology

Year:

2017

Language:

english

File:

PDF, 989 KB

english, 2017

8

The Effect of Filler ER4043 and ER5356 on Porosity Distribution of Welded AA6061 Aluminum Alloy

Nur Azida, Che Lah, Faizol, Muhammad Ahmad Ibrahim, Jalar, Azman, Sharif, J., Othman, Norinsan Kamil, Rashdi, Nasrizal Mohd

Journal:

Advanced Materials Research

Year:

2010

Language:

english

File:

PDF, 490 KB

english, 2010

9

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

Md Arshad, M. K., Ahmad, I., Jalar, A., Omar, G., Hashim, U.

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 601 KB

english, 2006

10

Temperature Dependence of Elastic–Plastic Properties of Fine-Pitch SAC 0307 Solder Joint Using Nanoindentation Approach

Jalar, Azman, Bakar, Maria Abu, Ismail, Roslina

Journal:

Metallurgical and Materials Transactions A

Year:

2020

Language:

english

File:

PDF, 1.27 MB

english, 2020

11

Effect of Porosity on Tensile Behaviour of Welded AA6061-T6 Aluminium Alloy

Ibrahim, Muhammad Faizol Ahmad, Bakar, S.R.S., Jalar, A., Othman, Norinsan Kamil, Sharif, J., Daud, A. R., Rashdi, N. M.

Journal:

Applied Mechanics and Materials

Year:

2011

Language:

english

File:

PDF, 1.61 MB

english, 2011

12

Effect of Hook Location for Ultra Fine Pitch Wirebonding Pull Testing Method

Harun, F., Jalar, Azman, Abdullah, Shahrum, Yunoh, Mohd Faridz Mod

Journal:

Key Engineering Materials

Year:

2011

Language:

english

File:

PDF, 358 KB

english, 2011

13

Effect of Conventional and Granular Capillaries Usage on the Bondability, Reliability and Manufacturability of Gold Wedge Bonds

Zulkifli, Muhammad Nubli, Jalar, Azman, Harun, Fuaida

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 478 KB

english, 2019

14

Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium–Gold-Silver Metallization

Ismail, Roslina, Harun, Fuaida, Zulkifli, Muhammad Nubli, Jalar, Azman, Bakar, Maria Abu, Abdullah, Shahrum

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 1.29 MB

english, 2015

15

Effects of PCB thickness on adjustable fountain wave soldering

AZIZ, M S ABDUL, ABDULLAH, M Z, KHOR, C Y, JALAR, A, BAKAR, M A, YUSOFF, W Y W, ANI, F CHE, YAN, NOBE, ZHOU, M, CHEOK, C

Journal:

Year:

2015

Language:

english

File:

PDF, 8.27 MB

english, 2015

16

The Performance of Nanosilicate from Rice Husk Ash as Green Corrosion Inhibitor for Carbon Steel in 0.5M HCl

Asra Awizar, Denni, Othman, Norinsan Kamil, Daud, Abdul Razak, Jalar, Azman, Zulkafli, Rabiahtul

Journal:

Materials Science Forum

Year:

2013

Language:

english

File:

PDF, 4.40 MB

english, 2013

17

Effect of Ca Content on Mechanical Properties of 4N Gold Wire for Quad Flat Nolead (QFN) Stacked Die Package

Jalar, Azman, Radzi, Saidatul Azura, Hamid, Muhammad Azmi Abd

Journal:

Advanced Materials Research

Year:

2010

Language:

english

File:

PDF, 309 KB

english, 2010

18

Bondability and Strength Evaluation of Gold Ball Bond Using Nanoindentation Approach

Zulkifli, Muhammad Nubli, Jalar, Azman, Abdullah, Shahrum, Othman, Norinsan Kamil

Journal:

Key Engineering Materials

Year:

2016

Language:

english

File:

PDF, 1.53 MB

english, 2016

19

Micro-Structural Studies of Thermosonic Cu-Al Bonding Interface

Anand, T. Joseph Sahaya, Kok Yau, Chua, Jalar, A.

Journal:

Advanced Materials Research

Year:

2014

Language:

english

File:

PDF, 950 KB

english, 2014

20

Sn-rich phase coarsening during isothermal annealing for as-soldered Sn–Ag–Cu solder

N. Saud, A. Jalar

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2010

Language:

english

File:

PDF, 1.12 MB

english, 2010

21

Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process

M.K. Md Arshad, A. Jalar, I. Ahmad

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.23 MB

english, 2007

22

Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition

Wan Yusoff, Wan Yusmawati, Ismail, Norliza, Safee, Nur Shafiqa, Ismail, Ariffin, Jalar, Azman, Abu Bakar, Maria

Journal:

Soldering & Surface Mount Technology

Year:

2019

Language:

english

File:

PDF, 422 KB

english, 2019

23

Adsorption isotherm and kinetic study of gas-solid system of formaldehyde on oil palm mesocarp bio-char: Pyrolysis effect

Abdul Manap, Nor Rahafza, Shamsudin, Roslinda, Maghpor, Mohd Norhafsam, Abdul Hamid, Muhammad Azmi, Jalar, Azman

Journal:

Journal of Environmental Chemical Engineering

Year:

2018

Language:

english

File:

PDF, 934 KB

english, 2018

24

Effect of wafer thinning methods towards fracture strength and topography of silicon die

Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 796 KB

english, 2006

25

[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - The re-evaluation of mechanical properties of wire bonding

Jalar, Azman, Zulkifli, Muhammad Nubli, Othman, Norinsan Kamil, Abdullah, Shahrum

Year:

2011

Language:

english

File:

PDF, 137 KB

english, 2011

26

Dicing Laminated Wafer for QFN 3D Stacked Die Packaging

Abdullah, S., Endut, Z., Ahmad, I., Jalar, Azman, Yusof, Suhaila M.

Journal:

Advanced Materials Research

Year:

2008

Language:

english

File:

PDF, 668 KB

english, 2008

27

[IEEE 2004 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2004.12.7-2004.12.9)] 2004 IEEE International Conference on Semiconductor Electronics - Alternative double pass dicing method for thin wafer laminated with die attach film

Hoh Huey Jiun,, Ahmad, I., Jalar, A., Omar, G.

Year:

2004

Language:

english

File:

PDF, 2.94 MB

english, 2004

28

AIP Conference Proceedings [Author(s) NOVEL TRENDS IN RHEOLOGY VII - Zlín, Czech Republic (26–27 July 2017)] - Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF)

Sarveswaran, C., Salleh, Emee Marina, Jalar, A., Samsudin, Z., Ali, M. Yusuf Tura, Ani, F. Che, Othman, N. K.

Year:

2017

Language:

english

File:

PDF, 535 KB

english, 2017

29

Synthesis and characterization of ZnO thin films by thermal evaporation

Siti Nuurul Fatimah Hasim, Muhammad Azmi Abdul Hamid, Roslinda Shamsudin, Azman Jalar

Journal:

Journal of Physics and Chemistry of Solids

Year:

2009

Language:

english

File:

PDF, 486 KB

english, 2009

30

AIP Conference Proceedings [AIP 2012 NATIONAL PHYSICS CONFERENCE: (PERFIK 2012) - Colmar Tropicale, Bukit Tinggi, Pahang, Malaysia (19–21 November 2012)] - Transformation nanostructured nickel hydroxide to nickel oxide film by aqueous chemical growth

Bakar, M. A., Hamid, M. A. A., Jalar, A., Shamsudin, R.

Year:

2013

Language:

english

File:

PDF, 1005 KB

english, 2013

31

Surface Topographical Characterization of Gold Aluminide Compound for Thermosonic Ball Bonding

Rosle, M. F., Abdullah, S., Hamid, M. A. A., Daud, A. R., Jalar, A., Kornain, Z.

Journal:

Journal of Electronic Packaging

Year:

2010

Language:

english

File:

PDF, 922 KB

english, 2010

32

In-vitro bioactivity of wollastonite materials derived from limestone and silica sand

Abd Rashid, Rashita, Shamsudin, Roslinda, Abdul Hamid, Muhammad Azmi, Jalar, Azman

Journal:

Ceramics International

Year:

2014

Language:

english

File:

PDF, 7.65 MB

english, 2014

33

Electrochemical Migration Behaviours of Low Silver Content Solder Alloy SAC 0307 on Printed Circuit Boards (PCBs) in NaCl Solution

Othman, Norinsan Kamil, Teng, Koh Yunn, Jalar, Azman, Che Ani, Fakhrozi, Samsudin, Zamri

Journal:

Materials Science Forum

Year:

2016

Language:

english

File:

PDF, 3.14 MB

english, 2016

34

CFD modeling of pin shape effects on capillary flow during wave soldering

Abdul Aziz, M.S., Abdullah, M.Z., Khor, C.Y., Jalar, A., Che Ani, F.

Journal:

International Journal of Heat and Mass Transfer

Year:

2014

Language:

english

File:

PDF, 2.73 MB

english, 2014

35

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Kornain, Z., Jalar, A., Rasid, R., Abdullah, S.

Journal:

Journal of Electronic Packaging

Year:

2010

Language:

english

File:

PDF, 567 KB

english, 2010

36

[IEEE 2014 IEEE 11th International Conference on Semiconductor Electronics (ICSE) - Kuala Lumpur, Malaysia (2014.8.27-2014.8.29)] 2014 IEEE International Conference on Semiconductor Electronics (ICSE2014) - Effects of thermal cycling on the mechanical properties of gold wire bonding

Yusoff, Wan Yusmawati Wan, Jalar, Azman, Othman, Norinsan Kamil, Rahman, Irman Abdul

Year:

2014

Language:

english

File:

PDF, 1.44 MB

english, 2014

37

An Optimization of Two-Steps Curing Profile to Eliminate Voids Formation in Underfill Epoxy for Hi-CTE Flip Chip Packaging

Kornain, Zainudin, Jalar, Azman, Rasid, Rozaidi, Abdullah, Shahrum

Journal:

Advanced Materials Research

Year:

2010

Language:

english

File:

PDF, 487 KB

english, 2010

38

Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package

Abdullah, S., Abdullah, M. F., Ariffin, A. K., Jalar, A.

Journal:

Journal of Electronic Packaging

Year:

2009

Language:

english

File:

PDF, 1.09 MB

english, 2009

39

Growth Behaviour of ZnO on Si (100) and Platinum Coated Glass Substrate from Aqueous Solution

Bakar, M.A., Hamid, Muhammad Azmi Abd, Jalar, A.

Journal:

Advanced Materials Research

Year:

2010

Language:

english

File:

PDF, 7.70 MB

english, 2010

40

Structural phase transformations in radiolytically synthesized Al–Cu bimetallic nanoparticles

Larki, Farhad, Abedini, Alam, Shabiul Islam, Md., Shaari, Sahbudin, Ali, Sawal Hamid Md, Susthitha Menon, P., Jalar, Azman, Saion, Elias, Sampe, Jahariah, Majlis, Burhanuddin Yeap

Journal:

Journal of Materials Science

Year:

2015

Language:

english

File:

PDF, 5.00 MB

english, 2015

41

High Temperature Storage and Gamma Radiation Effects on Mechanical Properties of Stacked Die Package

Jalar, Azman, Wan Yusoff, Wan Yusmawati, Othman, Norinsan Kamil, Abdul Rahman, Irman

Journal:

Advanced Materials Research

Year:

2014

Language:

english

File:

PDF, 358 KB

english, 2014

42

[IEEE 2015 International Conference on Computer, Communications, and Control Technology (I4CT) - Kuching, Sarawak, Malaysia (2015.4.21-2015.4.23)] 2015 International Conference on Computer, Communications, and Control Technology (I4CT) - Performance on optical properties of AWG based on SOI demultiplexer and receiver sensitivity in CWDM system

Juhari, Nurjuliana, Susthitha Menon, P, Ehsan, Abang Annuar, Shaari, Sahbudin, Jalar, Azman, Majlis, Burhanuddin Yeop

Year:

2015

Language:

english

File:

PDF, 1.84 MB

english, 2015

43

The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly

Che Ani, F., Jalar, A., Saad, A. A., Khor, C. Y., Ismail, R., Bachok, Z., Abas, M. A., Othman, N. K.

Journal:

The International Journal of Advanced Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 3.67 MB

english, 2018

44

Substrate Dependence of the Properties of MgO Films Produced Using an Aqueous Chemical Growth Method

Azmi Abdul Hamid, Muhammad, Abu Bakar, Maria, Jalar, Azman, Shamsudin, Roslinda

Journal:

Current Nanoscience

Year:

2012

File:

PDF, 826 KB

2012

45

A wide-band UV photodiode based on n-ZnO/p-Si heterojunctions

Al-Hardan, N.H., Jalar, Azman, Abdul Hamid, M.A., Keng, Lim Kar, Ahmed, N.M., Shamsudin, R.

Journal:

Sensors and Actuators A: Physical

Year:

2014

Language:

english

File:

PDF, 1.46 MB

english, 2014

46

[IEEE 2004 IEEE International Conference on Semiconductor Electronics - Kuala Lumpur, Malaysia (2004.12.7-2004.12.9)] 2004 IEEE International Conference on Semiconductor Electronics - The effects of zincation process on aluminum bond pad surfaces for electroless nickel immersion gold (ENIG) deposition

Arshad, M.M.M., Ahmad, I., Jalar, A., Omar, G.

Year:

2004

Language:

english

File:

PDF, 3.53 MB

english, 2004

47

[IEEE 2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium - San Jose, CA, USA (2007.10.3-2007.10.5)] 2007 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium - Pb-free BGA Solder Joint Reliability Improvement with Sn3.5Ag Solder Alloy on Ni/Au Finish

Leng, Eu Poh, Ding, Min, Lindsay, Wayne, Chopin, Sheila, Ahmad, Ibrahim, Jalar, Azman

Year:

2007

Language:

english

File:

PDF, 4.72 MB

english, 2007

48

Nanoindentation Test for the Stiffness Distribution Analysis of Bonded Au Ball Bonds

Othman, N.K., Zulkifli, Mohd Nubli, Jalar, Azman, Abdullah, Shahrum

Journal:

Advanced Materials Research

Year:

2010

Language:

english

File:

PDF, 826 KB

english, 2010

49

Oxidation Effect on Welded AA6061 Al Alloy Using ER4043 Filler Metal

Nur Azida, Che Lah, Jalar, Azman, Othman, Norinsan Kamil, Daud, Abdul Razak

Journal:

Applied Mechanics and Materials

Year:

2011

Language:

english

File:

PDF, 307 KB

english, 2011

50

AIP Conference Proceedings [AIP Publishing LLC THE 2014 UKM FST POSTGRADUATE COLLOQUIUM: Proceedings of the Universiti Kebangsaan Malaysia, Faculty of Science and Technology 2014 Postgraduate Colloquium - Selangor, Malaysia (9–11 April 2014)] - Effect of plasma spray parameters on porosity of fly ash deposited coatings

Muhammad, M. M., Jalar, A., Shamsudin, R., Isa, M. C.

Year:

2014

Language:

english

File:

PDF, 1.40 MB

english, 2014

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